AMD CPU Ryzen 9 5950X

If something distinguishes these new AMD processors and their Zen 3 architecture, it is the brutal increase in IPC or number of instructions per cycle. Much more important than its increase in frequency, since this allows it to achieve much higher yields than the previous generation using the same lithography. The room for improvement was therefore large and TSMC has made the architecture envisioned by AMD effective.

This results in better performance in games, in fact now we can consider these processors as full-fledged gaming CPUs. Especially the 5600X and 5900X, although really all the best in class at 6, 8 or 12 cores. This AMD Ryzen 9 5950X will not be the exception, but its performance will be much better used in megatera, rendering equipment, content creators and Workstation for virtualization. In games it will stay a little below its younger brothers, at least in games of this and previous generations.

In terms of appearance, we have no difference with the 3950 of the previous generation or with its brothers. At the top we have an encapsulation made of copper and aluminum that is responsible for collecting all the heat from the three internal Dies and transferring it to a heat sink. Indeed, here two complete CCDs will be used, in which said encapsulation will be welded to improve heat transfer.

The surface area remains unchanged as well as the height, since ultimately the dimensions are the same when installed on an AM4 socket. One more generation with this PGA-type socket and possibly it will be the last, since in Zen 4 it is possible that it will release DDR5 memories and a 5nm manufacturing process. AMD has been around for quite a few generations now with its 1331-pin socket implemented in a delicate matrix on the gold-plated CPU substrate.

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